Procesný tok hliníkového substrátu

1. Otvorenie

Proces výroby hliníkového substrátu

1. Proces rezania materiálu - rezanie

2. Účel otvorenia

Narežte veľké-prichádzajúce materiály na veľkosť potrebnú na výrobu

3. Bezpečnostné opatrenia pri otváraní materiálov

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Vŕtanie

1. Proces vŕtania

Hmoždinky - Vŕtanie - Kontrolná doska

2. Účel vŕtania

Polohovanie a vŕtanie dosky napomáhajúce následnému výrobnému procesu a montáži u zákazníka

3. Bezpečnostné opatrenia pri vŕtaní

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Druhý vrták: otvor pre nástroj v jednotke po spájkovacej maske

3. Zobrazovanie suchého/mokrého filmu

1. Proces zobrazovania suchého/mokrého filmu

Brúsna doska - film - expozícia - vyvolávanie

2. Účel zobrazenia suchého/mokrého filmu

Časti potrebné na výrobu obvodu sú vykreslené na hárku

3. Bezpečnostné opatrenia pre zobrazovanie suchého/mokrého filmu

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Kyslé/alkalické leptanie

1. Proces kyslého/alkalického leptania

Leptanie - odizolovanie - sušenie - inšpekčná doska

2. Účel kyslého/alkalického leptania

Po zobrazení suchého/mokrého filmu ponechajte požadovanú časť okruhu, odstráňte prebytočnú časť mimo okruhu a dávajte pozor na koróziu hliníkového substrátu leptacím roztokom pri leptaní kyselinou;

3. Preventívne opatrenia pre kyslé/alkalické leptanie

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Päť, sieťotlačová spájkovacia maska, znaky

1. Sieťová spájkovacia maska, znakový proces

Sieťotlač - Pred-pečenie - Expozícia - Vývoj - Postavy

2. Účel sieťotlačovej spájkovacej masky a znakov

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Záležitosti, ktoré si vyžadujú pozornosť v súvislosti so sieťotlačovou spájkovacou maskou a znakmi

① To check whether there is garbage or foreign matter on the board

COB hliníkový substrát

COB hliníkový substrát

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, doska na gong

1. V-CUT, proces dosky gongu

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, účel dosky gongu

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Bezpečnostné opatrenia pre V-CUT a dosku gongu

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Sedem, test, OSP

1. Test, OSP proces

Test linky - Test odolnosti proti napätiu - OSP

2. Testovanie, účel OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, testovanie, opatrenia OSP

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Osem, FQC, FQA, balenie, doprava

1. Proces

FQC - FQA - Balenie - Zásielka

2. Účel

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Venujte pozornosť

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3